| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the thickness of an inlet for a non-contact type electronic tag and to improve the reliability of the inlet. <P>SOLUTION: An inlet for an electronic tag is provided with an antenna 14 consisting of a Cu film stuck to one surface of a rectangular insulating film consisting of polyimide resin film and a semiconductor chip 5 connected to the antenna 14. A rectangular notch 16 exposing the insulating film by removing the Cu film constituting the antenna 14 is formed on the corner part of an L-shaped slit 15 formed on the antenna 14. Four lead patterns 17 constituted integrally with the antenna 14 and extending their tips in the corner part direction of the slit 15 are formed on the inside of the notch 16. The Au bumps (9a-9d) of the semiconductor chip 5 are connected to the lead patterns 17 through an Au-Sn eutectic alloy layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
