发明名称 CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a cutting method by which the generation of cracking can be prevented even if a workpiece is formed of brittle member. SOLUTION: The cutting method is used to cut a workpiece that is held on a chuck table 3 and is formed of brittle material, into chips like a grid by cutting blade. In this case, when the workpiece is held on the chuck table 3, a placement surface for placing the workpiece is made even and smooth, and a workpiece holding plate 31 with a plurality of suction holes 314 open to the placement surface is interposed on the chuck table 3. The workpiece held on the upper surface of a dicing tape that is attached to a circular frame is placed on the placement surface of the plate 31 with the dicing tape in between. Then, while the workpiece is sucked by the suction holes 314 and is held on the placement surface of the plate 31, it is cut into chips like a grid by the cutting blade. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356357(A) 申请公布日期 2004.12.16
申请号 JP20030151912 申请日期 2003.05.29
申请人 DISCO ABRASIVE SYST LTD 发明人 KAJIYAMA KEIICHI;NITTA YUJI
分类号 H01L21/301;(IPC1-7):H01L21/301 主分类号 H01L21/301
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