发明名称 LIQUID DROP EJECTION PRODUCTION APPARATUS, AND PATTERN WIRING BOARD TO BE PRODUCED BY SAME, AS WELL AS DEVICE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a liquid drop ejection production apparatus capable of producing a high quality, high accuracy and high reliability pattern wiring board or a device substrate with high yield and exhibiting reliability in long term use, and to provide a high accuracy, high quality and high reliability pattern wiring board or a device substrate being produced by the apparatus. SOLUTION: On a substrate, solution containing fine particles is ejected with an action force by mechanical displacement to form a rectangular pattern or to form an electrode pattern by combining the rectangular patterns wherein the corner part of the pattern is covered with a dot pattern. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356389(A) 申请公布日期 2004.12.16
申请号 JP20030152371 申请日期 2003.05.29
申请人 RICOH CO LTD 发明人 SEKIYA TAKURO
分类号 B41J2/01;B05C5/00;H05K3/10;(IPC1-7):H05K3/10 主分类号 B41J2/01
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