| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board for improving connection reliability of a solder bump deposited on a connection pad. SOLUTION: The wiring board 101 is provided with main-side first and second openings 1281 and 1282 which open to a board main face 102 and whose opening diameters are not more than 110μm, main-side first and second connection pads 1491 and 1492 arranged in the openings, and first and second solder bumps 1511 and 1512 deposited on the main-side first and second connection pads 1491 and 1492. The manufacturing method has a process for installing solder paste 151P on the main-side first and second openings 1281 and the like, pressing solder paste 151P to the main-side first and second connection pads 1491 and the like, heating it. dissolving solder and forming the first and second solder bumps 1511 and the like. COPYRIGHT: (C)2005,JPO&NCIPI
|
