CURING RESIN COMPOSITION, SEALING MATERIAL FOR LIQUID CRYSTAL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE
摘要
<p>A curing resin composition is disclosed which scarcely contaminates liquid crystal when used as a sealing material for a liquid crystal display device in a dispenser method for producing the liquid crystal display device. The curing resin composition has excellent adhesion to a glass and does not cause cell gap variations. Also disclosed are a sealing material for liquid crystal display devices and a liquid crystal display device. The curing resin composition contains a curing resin which is photo-curing and/or heat-curing and a polymerization initiator. The curing resin is a crystalline (meth)acrylate-modified epoxy resin having a (meth)acryl group and an epoxy group in one molecule.</p>
申请公布号
WO2004108790(A1)
申请公布日期
2004.12.16
申请号
WO2004JP07811
申请日期
2004.06.04
申请人
SEKISUI CHEMICAL CO., LTD.;TANIKAWA, MITSURU;WATANABE, TAKASHI;OYAMA, YUICHI;YAMAMOTO, TAKUYA;UWAGAWA, SADAMU