发明名称 CURING RESIN COMPOSITION, SEALING MATERIAL FOR LIQUID CRYSTAL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE
摘要 <p>A curing resin composition is disclosed which scarcely contaminates liquid crystal when used as a sealing material for a liquid crystal display device in a dispenser method for producing the liquid crystal display device. The curing resin composition has excellent adhesion to a glass and does not cause cell gap variations. Also disclosed are a sealing material for liquid crystal display devices and a liquid crystal display device. The curing resin composition contains a curing resin which is photo-curing and/or heat-curing and a polymerization initiator. The curing resin is a crystalline (meth)acrylate-modified epoxy resin having a (meth)acryl group and an epoxy group in one molecule.</p>
申请公布号 WO2004108790(A1) 申请公布日期 2004.12.16
申请号 WO2004JP07811 申请日期 2004.06.04
申请人 SEKISUI CHEMICAL CO., LTD.;TANIKAWA, MITSURU;WATANABE, TAKASHI;OYAMA, YUICHI;YAMAMOTO, TAKUYA;UWAGAWA, SADAMU 发明人 TANIKAWA, MITSURU;WATANABE, TAKASHI;OYAMA, YUICHI;YAMAMOTO, TAKUYA;UWAGAWA, SADAMU
分类号 C08G59/18;C08F290/06;C08L63/10;G02F1/1339;(IPC1-7):C08G59/17;C08F299/02;G02F1/133 主分类号 C08G59/18
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