| 摘要 |
The solder terminal element (7) has an insulating foil (11) applied to the end face of the electrical conductor (9), provided with at least one opening (13), enclosing at least one contact surface (10), for connection with a terminal surface (15) of the conductor structure applied to the substrate (1). The thickness of the insulating foil and the surface area of the opening is matched to the metal volume of a solder deposit (14) providing the electrical connection between the contact surface and the terminal surface. An Independent claim for a method for providing a solder connection between an electrical conductor and a conductor structure is also included. |
