| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a wiring board having constitution whose soldered state of the semiconductor device and the wiring board having terminals inside of the BGA type semiconductor device or the like can be accurately and easily confirmed. SOLUTION: A through hole 37 is provided on the package 38, and a conductor 39 such as copper having a patter part shown therein and on the face is provided. Four lead-out patterns 39a, 39b, 39c and 39d extending in four orthogonal directions from ring-like lands being a part of a ring-like bump 42 and the conductor 39 are formed on the circumference of the through hole 37 on the rear face of the package 38. The patterns 39a-39d have a function for improving inspection precision of a soldered state by an X-ray transmission image. |
