Semiconductor electronic device and method of manufacturing thereof

摘要

A semiconductor electronic device is described comprising a die (2) of semiconductor material having a plurality of contact pads (3,8) electrically connected to a support for example through interposition of contact wires, said plurality of contact pads (3,8) comprising signal pads (8) and power pads (3), the device being characterised in that said signal pads (8) are implemented on the die (2) of semiconductor material with a mutual pitch (P2) lower than the pitch (P1) between said power pads (3), and in that the upper metallic layer of the signal pads is thinner than that of the power pads.