Electronic device, method of manufacturing the same, and apparatus for manufacturing the same

摘要

An electronic device such as a semiconductor device, a method of manufacturing the same, and an apparatus for manufacturing the same, wherein by placing a ceramic substrate (32) provided with a metallic thin film (2) integrated into at least one selected from an upper surface and a lower surface of the ceramic substrate (32) in its peripheral portion so as to extend both inside and outside a cavity (38) of a mold for transfer molding, and positioning the metallic thin film (2) in a position with which an upper mold (30) and a lower mold (31) of the mold come into contact, occurrence of cracks or breakage in the ceramic substrate is prevented by buffering the pressure applied to the ceramic substrate so as to prevent a distortion force from being caused even when the ceramic substrate is sandwiched and compressed between the upper mold and the lower mold.