MANIFOLD INCORPORATING A THERMOELECTRIC MODULE AND A COOLING DEVICE USING THE THERMOELECTRIC MODULE,申请号EP19980945620-传众专利搜索

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发明名称	MANIFOLD INCORPORATING A THERMOELECTRIC MODULE AND A COOLING DEVICE USING THE THERMOELECTRIC MODULE
摘要
申请公布号	EP0945692(A4)	申请公布日期	2004.12.15
申请号	EP19980945620	申请日期	1998.10.05
申请人	MATSUSHITA REFRIGERATION COMPANY	发明人	INOUE, HISAYOSHI;INAMORI, SHOHEI;FUJIMOTO, MASATSUGU;UETSUJI, TOSHIO;KIDO, OSAO
分类号	F25B21/02;H01L35/30;(IPC1-7):F25B21/02;F04D1/00;H01L23/38;H01L35/28	主分类号	F25B21/02
代理机构		代理人
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