发明名称 |
Semiconductor die package with semiconductor die having side electrical connection |
摘要 |
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package includes a circuit substrate including a conductive region. A semiconductor die is on the circuit substrate. The semiconductor die includes an edge and a recess at the edge. A solder joint couples the semiconductor die and the conductive region through the recess.
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申请公布号 |
US6830959(B2) |
申请公布日期 |
2004.12.14 |
申请号 |
US20030346682 |
申请日期 |
2003.01.17 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
ESTACIO MARIA CRISTINA B. |
分类号 |
H01L23/12;H01L21/301;H01L21/768;H01L23/48;H01L23/485;H01L23/498;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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