发明名称 |
Stress-relieving heatsink structure and method of attachment to an electronic package |
摘要 |
A stress-relieving heatsink structure and method of forming thereof for an electronic package, for instance, that including a semiconductor chip package which is mounted on a wired carrier, such as a circuitized substrate. The heatsink structure is constituted from a plurality of base structures which are joined along slits so as to impart a degree of flexibility to the electronic package inhibiting the forming of stresses tending to cause delamination of the package components.
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申请公布号 |
US6830960(B2) |
申请公布日期 |
2004.12.14 |
申请号 |
US20020225860 |
申请日期 |
2002.08.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ALCOE DAVID J.;STUTZMAN RANDALL J. |
分类号 |
H01L23/367;H01L23/42;(IPC1-7):H10L21/44;H10L21/48;H10L21/50 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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