| 摘要 |
A new board mounted electromechanical device (103) is provided that mounts t o a relay substrate (122) to form a low profile reed relay (100). The reed rel ay (103) is electrically connected to the electrical contacts (128) via a signa l traces (130) and additional electrical traces (130) located on the same side of the relay substrate (122) which connect to the relay's signal and shielding. Additional traces (130) on both sides of the signal traces of the reed relay (103) provide a co-planar waveguide to maintain the desired impedance of the signal path. The reed relay (103) is mounted in an inverted manner into a cut-out (134) in the main circuit board (132) so that the othe r portion of the need relay (103) itself is sits within the cut-out (134) in t he main circuit board (132). As a result, the need relay component (103) is recessed below the surface of the main circuit board (132) resulting in an overall low profile circuit board.
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