发明名称 Shallow trench isolation using low dielectric constant insulator
摘要 A shallow trench isolation is disclosed wherein the trench depth is reduced beyond that achieved in prior art processes. The reduced trench depth helps to eliminate the formation of voids during the trench refill process and provides for greater planarity in the final isolation structure. Effective device isolation is achieved with a reduced trench depth by utilizing refilling dielectric materials having low dielectric constant.
申请公布号 US6831347(B1) 申请公布日期 2004.12.14
申请号 US19970932228 申请日期 1997.09.17
申请人 MICRON TECHNOLOGY, INC. 发明人 SCHUEGRAF KLAUS F.;AHMAD AFTAB
分类号 H01L21/762;(IPC1-7):H01L29/00 主分类号 H01L21/762
代理机构 代理人
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