| 摘要 |
The invention concerns a method for producing a solder paste stencil (1), said stencil being made of a sheet material (2) and having a first side (3), to be brought into contact with a printed circuit board (5), PCB, in use, and a second side (4), on which a solder paste (6) is applied in use, said stencil being formed with at least one through hole (7) extending from said first side (3) to said second side (4). The method includes forming at least a surface layer (15) of the walls (8) of said at least one hole (7) with a low surface energy material. The invention also concerns a stencil (1) produced with the above method. |
