METHOD FOR PREPARING ORGANOSILICATE FILM HAVING LOW DIELECTRIC PROPERTIES TO ENHANCE MECHANICAL PROPERTIES

摘要

PURPOSE: A method for preparing an organosilicate glass film having low dielectric properties is provided to enhance mechanical properties by controlling the amount of organic groups. CONSTITUTION: The method for preparing an organosilicate glass film having low dielectric ratio such as 4.0 or less comprises: preparing one of mixtures selected from (i) a mixture of a first silicon-containing precursor which comprises 3-4 numbers of Si-O bonds per Si atom, 0-1 number of a bond selected from Si-H, Si-Br or Si-Cl bond per Si atom, and 0 number of Si-C bond, and a second silicon-containing precursor which comprises at least one Si-C bond per Si atom; (ii) a mixture of asymmetric silicon-containing precursor which has the ratio of Si-C to Si atom by number is 1 or less; introducing the mixture into a reacting chamber which contains a substrate therein; and supplying energy to induce a reaction, and conduct deposition of the organosilicate glass film onto the substrate.