| 摘要 |
FIELD: processes and tools for soldering different designation articles, namely sealing module cases in microelectronics. ^ SUBSTANCE: soft solder may be in the form of wire, strip or foil and it contains components at next relation, mass %: indium, 48 -52; tin, 46 -50; gallium, 0.6 - 2.0; zinc, 0.6 - 2.0. Relation of gallium content to that of tin and zinc content to that of tin is in range 1/75 - 1/25. Solder provides ultimate strength of soldered articles at low temperature soldering. ^ EFFECT: increased strength of soldered joints at their high capability for deformation. ^ 1 tbl, 6 ex |
