| 摘要 |
PURPOSE: A bonding apparatus, an anisotropic conductive film and a circuit substrate for a flat panel display are provided to enable the anisotropic conductive film and the circuit substrate to be bonded by a single device and minimize the deviation of setting, thereby enhancing the bonding quality and productivity. CONSTITUTION: A rotary stage(4) is rotatably mounted at a working die(2). Loading members(6) are mounted at the rotary stage and loads and sets a glass and a circuit substrate. A film bonding member(8) is arranged, adjacent to the rotary stage, at the working die, bonds an anisotropic conductive film to the glass loaded to the loading members. A circuit substrate bonding member(10) is separately arranged to the film bonding member at the working die and bonds the circuit substrate to the glass having the bonded anisotropic conductive film.
|
