Devices and method of their manufacture

摘要

In fabricating an apparatus such as a silicon device or an optical device initially a wafer having a plurality of dies is formed. These dies are then separated into individual dies and the individual dies are formed into encapsulated devices having input and/or output leads. The dies are separated by a means that is not based on crystallographic plane cleavage. Additionally the boundary along which the separation is performed is not a linear path. By employing non-linear paths that are not constrained by crystallographic planes, device yield per wafer is substantially improved particularly for dies having non-linear boundaries. In one embodiment the dies are separated using an alternating dry etching and polymer deposition technique.