| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which is improved in moisture resistance to restrain moisture from penetrating into it from the outside and which is reduced in occupied area and in thickness. SOLUTION: The semiconductor package 30 is composed of a wiring board 10 whose one surface opposite to its other surface where a semiconductor element mounting region MR is demarcated is subjected to water repellent finishing, and a frame 20 which is formed of a resin and provided with an opening larger than the semiconductor element mounting region MR. The wiring board 10 and the frame 20 are bonded together so as to form a recessed part RP for housing a semiconductor element. A wiring board is formed of specific material that has both water-repellent properties to restrain water from penetrating and moisture-permeable properties to transmit water vapor, and can be used instead of the wiring board 10 whose one side is subjected to water-repellent finishing. Furthermore, a sheet-like metal member for preventing moisture from being absorbed from the outside might be provided to the bottom or the inner side of the wiring board 10 at a position below the semiconductor element mounting region MR inside the recessed part RP. COPYRIGHT: (C)2005,JPO&NCIPI |
