| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device capable of suppressing a stress applied to an insulating plate. SOLUTION: A resin case 4 presses an extension piece 6a of a metal film 6 provided in an insulating plate 1 against a heat sink 3 by screwing of a bolt 10. For this reason, another surface of the insulating plate 1 is closely adhered to a surface of the heat sink 3 via the metal film 6 and a grease layer 9. At this point, a stress pressing to the heat sink 3 side is not directly applied to the insulating plate 1. As a result, since the stress applied to the insulating plate 1 is decreased, cracks are hard to occur in the insulating plate 1. COPYRIGHT: (C)2005,JPO&NCIPI |
