| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board wherein formation of a fine pattern is facilitated, manufacturing process is simplified and installation cost and production cost are reduced, and also to provide its manufacturing method. SOLUTION: In the multilayer wiring board, drawing formation of the circuit pattern of a wiring board is performed by an ink jet method using conductive metal paste on an insulating substrate which is composed of thermoplastic resin composite whose main component is polyarylketone resin whose crystal dissolution peak temperature is at least 260°C and noncrystal polyetherimide resin. A plurality of wiring substrates on which the circuit patterns are formed are laminated. The wiring substrates are mutually bonded, formed integrally and crystallized by thermal fusion. Wiring which electrically connects between the respective wiring substrates is composed of conductive material wherein conductive metal paste is harden. COPYRIGHT: (C)2005,JPO&NCIPI |
