| 摘要 |
PROBLEM TO BE SOLVED: To suppress an increase in resistance of a wiring and a connection plug, while suppressing an occurrence of voids by a stress migration in a wiring structure having the wiring and connection plug made of copper. SOLUTION: A second interlayer insulating film 5 is formed on a first copper wiring 2 formed in a first interlayer insulating film 1 through a barrier insulating film 4. A second copper wiring 6 and a connection plug 7 made of copper are formed in the second interlayer insulating film 5. An alloy layer 10 made of copper is formed in only a portion connected to the connection plug 7 above the first copper wiring 2. COPYRIGHT: (C)2005,JPO&NCIPI
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