发明名称 METHOD OF PEELING LAMINATE, METHOD OF MANUFACTURING THIN FILM DEVICE, THIN FILM DEVICE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of peeling laminate by which a laminate can be peeled without giving any breakage nor damage caused by the irradiation of laser light to the laminate in a peeling and transferring technique by which the laminate is transferred between substrates. SOLUTION: This method of peeling laminate includes a step (Fig. 1 (not shown)) of forming the laminate (4) by laminating a plurality of films upon a substrate (1) through a releasable layer (2), a step of reducing the coupling force of the releasable layer (2) by irradiating the layer (2) with light, and a step (Fig.) of peeling the substrate (1) from the laminate (4). In the method, the irradiation of the releasable layer (2) with the light is performed by repeatedly irradiating the layer (2) with laser light by superimposing the outer peripheral sections of rectangular or linear irradiated areas having finite widths upon another, so that the outer peripheral sections may be irradiated with the laser light twice or more in the rising section or falling section of the intensity profile of the laser light (Fig. 5 (not shown)). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004349543(A) 申请公布日期 2004.12.09
申请号 JP20030146178 申请日期 2003.05.23
申请人 SEIKO EPSON CORP 发明人 UTSUNOMIYA SUMIO
分类号 B32B7/04;H01L21/02;H01L21/336;H01L27/12;H01L29/786;(IPC1-7):H01L27/12 主分类号 B32B7/04
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