| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition capable of providing a cured product having extremely suitable workability and extremely good adhesiveness to element surface (particularly a photosensitive polyimide, a nitrided film or an oxidized film), and having high moisture resistance and particularly capable of becoming a sealing material excellent in high-temperature thermal shock and having≥260°C reflow temperature and to provide a flip chip type semiconductor device sealed with the cured product of the composition. SOLUTION: The liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) an aromatic amine-based curing agent comprising one or more kinds of aromatic amine compounds represented by formulas (1) to (3) (wherein R<SP>1</SP>to R<SP>4</SP>are each hydrogen or a 1-6C monovalent hydrocarbon group) in an amount of≥5 mass% based on whole curing agent and (C) an inorganic filler, having 0.1-5μm average particle diameter, in which the content of the inorganic filler having a particle diameter of≥1/2 based on gap size of flip chip type semiconductor device is≤0.1 mass% based on whole inorganic filler. The flip chip type semiconductor device is obtained by sealing with the cured product as an underfill material. COPYRIGHT: (C)2005,JPO&NCIPI
|
