发明名称 THERMALLY COMPENSATED PIEZOELECTRIC ASSEMBLY
摘要 Piezoelectric assembly, comprising a piezoelectric element (11) being capable of an electrically induced mechanical expansion in one dimension when supplied with a suitable electrical voltage, which piezoelectric element (11) is situated between a limiting element (141) and a piston element, which piston element is, by the electrically induced expansion of the piezoelectric element, movable relative to the limiting element (141); and further comprising a thermal compensation means compensating for relative changes in position between the piston element and the limiting element (141) due to a thermally induced expansion of the piezoelectric element (11) by means of an elastic element (12) mechanically buffering thermally induced expansions of the piezoelectric element (11); wherein a mechanical isolation means (15, 16, 17) for mechanically isolating the elastic element (12) during electrically induced expansions of the piezoelectric element (11).
申请公布号 WO2004107465(A2) 申请公布日期 2004.12.09
申请号 WO2004EP50944 申请日期 2004.05.27
申请人 SIEMENS VDO AUTOMOTIVE S.P.A.;MARIANI, GIUSEPPE;ZANOBONI, CRISTIANO 发明人 MARIANI, GIUSEPPE;ZANOBONI, CRISTIANO
分类号 F02M61/16;F02M63/00;H01L41/053;H02N2/04 主分类号 F02M61/16
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