发明名称 |
THERMALLY COMPENSATED PIEZOELECTRIC ASSEMBLY |
摘要 |
Piezoelectric assembly, comprising a piezoelectric element (11) being capable of an electrically induced mechanical expansion in one dimension when supplied with a suitable electrical voltage, which piezoelectric element (11) is situated between a limiting element (141) and a piston element, which piston element is, by the electrically induced expansion of the piezoelectric element, movable relative to the limiting element (141); and further comprising a thermal compensation means compensating for relative changes in position between the piston element and the limiting element (141) due to a thermally induced expansion of the piezoelectric element (11) by means of an elastic element (12) mechanically buffering thermally induced expansions of the piezoelectric element (11); wherein a mechanical isolation means (15, 16, 17) for mechanically isolating the elastic element (12) during electrically induced expansions of the piezoelectric element (11). |
申请公布号 |
WO2004107465(A2) |
申请公布日期 |
2004.12.09 |
申请号 |
WO2004EP50944 |
申请日期 |
2004.05.27 |
申请人 |
SIEMENS VDO AUTOMOTIVE S.P.A.;MARIANI, GIUSEPPE;ZANOBONI, CRISTIANO |
发明人 |
MARIANI, GIUSEPPE;ZANOBONI, CRISTIANO |
分类号 |
F02M61/16;F02M63/00;H01L41/053;H02N2/04 |
主分类号 |
F02M61/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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