| 摘要 |
<p>The present invention relates to electrically attaching a surface mount device (10) to a mounting structure (12) via their respective contact pads (14, 16) using an attach material (28), such as solder or conductive epoxy, which includes a filler material (30). In general, the filler material is relatively solid and granular shaped, wherein the diameter of the filler material controls a mounting distance (d) between the surface mount device and the mounting structure. The filler allows a desired distance to be maintained during initial placement of the surface mount device and any subsequent reheating.</p> |
