METHOD OF CONDITIONING THERMOPLASTIC POLYMER PACKAGES

摘要

The present invention relates to a method of conditioning thermoplastic polymer packages, which are molded from thermoplastic preforms comprising the steps of: d) providing a solution with 0.1 to 15.0 wt-% of an antistatic composition e) contacting the thermoplastic preform with the antistatic composition on the outer surface, f) blow molding the molded package from the preform by a molding proc­ess directly after steps a) and b) or alternatively in a later separate proc­ess step. Furthermore the invention relates to the use of an antistatic composition as a solution for the conditioning treatment of polyester molds and/or polyester preforms.