发明名称
摘要 A process for forming a power MOSFET enables the connection a metal gate electrode to the conductive polysilicon gates in the active area without an additional mask step. In the process, a groove is formed in the field oxide during the active area mask step. Conductive polysilicon is then formed over the active area and into the groove. At least one window is formed over the groove along with the mask window for forming the channel and source implant windows, and the polysilicon is etched to the silicon surface in the active area, but a strip is left in the groove. This strip is contacted by gate metal during metal deposition. Thus, gate metal is connected to the polysilicon without an added mask step.
申请公布号 JP2004537160(A) 申请公布日期 2004.12.09
申请号 JP20020576024 申请日期 2002.03.08
申请人 发明人
分类号 H01L21/3205;H01L21/336;H01L23/52;H01L29/423;H01L29/78 主分类号 H01L21/3205
代理机构 代理人
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