| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical communication module which reduces heat resistance. SOLUTION: An optical communication module 1 comprises a photoelectric converting device 12 with a wiring substrate 18 having a part mounting surface 18a and a facing surface 18b facing each other, and a housing 2 defining a space for containing the photoelectric converting device 12. The wiring substrate 18 includes a first conductive layer 18g for mounting an electric part 19 provided on the part mounting surface 18a, a second conductive layer 18e provided on the facing surface 18b, and a conductive part 18f for connecting the first conductive layer 18g and the second conductive layer 18c provided through the wiring substrate. The housing 2 includes a conductive member, which has a contact part 10f for contacting the second conductive layer 18e. COPYRIGHT: (C)2005,JPO&NCIPI
|
