| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple method for machining the surface of an electrode capable of removing a selective metal coated layer such as a metalized layer or the like without the use of a mask. SOLUTION: The method for removing a gold plated layer 4 of the electrode 1 comprises the steps of contacting a solder layer supplied and melted on the base board such as a glass epoxy resin plate 6 or the like having the surface of a solder wettability copper or the like to the gold plated layer of the electrode, diffusing a gold atom of the gold plated layer into a solder layer, and separating the electrode from the solder layer. The solder layer to be contacted to the electrode may be melted in advance or melted after the mounting of the electrode. A part of the electrode can be selectively cooled to the temperature lower than the melting point of the solder with the use of a cooling member. COPYRIGHT: (C)2005,JPO&NCIPI
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