| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package for a solid state imaging device, which has a thin shape, a low cost and high degree of freedoms of mounting. SOLUTION: A method for manufacturing the semiconductor package for the solid state imaging device includes steps of: temporarily adhering a film-like thermoplastic adhesive to a flexible wiring board; forming a recess on a metal board by drawing; heat press bonding the flexible wiring board and the metal board via the film-like adhesive; electrically connecting a solid state imaging element chip to the flexible wiring board by mounting the solid stage imaging element chip in the recess of the metal board; and sealing a light transmittance board by adhering to the metal board to form a hollow structure. COPYRIGHT: (C)2005,JPO&NCIPI
|
