| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser module which is reduced enough in stress and improved in manufacturing yield. SOLUTION: The semiconductor laser module is equipped with a semiconductor laser element 1, a sub-mount 2 mounted with the semiconductor laser element 1 bonded thereto through the intermediary of a solder material 3, and a pedestal 4 mounted with the sub-mount 2 bonded thereto through the intermediary of a solder material 5. At this point, provided that the width of the sub-mount 2 in the direction perpendicular to the direction of an optical axis of the semiconductor laser element 1 is represented by W, the thickness of the sub-mount 2 is represented by T, W and T are so set as to satisfy formula, T/W≥0.15. COPYRIGHT: (C)2005,JPO&NCIPI
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