| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicon compound having an epoxy group which gives a cured product having high heat resistance. SOLUTION: The silicon compound having an epoxy group is obtained by the hydrolysis and condensation of an alkoxysilane having an epoxy group in the molecule with a basic catalyst. The thermosetting resin composition comprises this silicon compound and a curing agent. COPYRIGHT: (C)2005,JPO&NCIPI
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