| 摘要 |
A method and corresponding apparatus for mounting surface mount (SMT) components in a printed circuit board (PCB) add an aperture, i.e., an etched well, to the PCB to effectuate direct connection of high speed signals to the SMT components. The method eliminates the need of via and may be applied to any SMT components, such as inductors, resistors, capacitors, chips, and other components. In addition, since signal traces are shielded (not exposed to air), undesired side-effects, such as Electro-Magnetic Interference (EMI) and Cross Talk, and the like, may be reduced significantly. The method also ensures tighter signal impedance control and better propagation delay control. Additionally, faulty components may be replaced and/or repaired.
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