发明名称 |
Semiconductor device and method for manufacturing the same, circuit board and electronic equipment |
摘要 |
A semiconductor device includes a semiconductor substrate including an integrated circuit and an electrode. A resin layer is provided on a side of the semiconductor substrate where the electrode is formed and a wiring layer is formed on an area reaching from the electrode to a top of the resin layer. The electrode has a first rim part facing a periphery of the semiconductor substrate and a second rim part facing a center region of the semiconductor substrate. The resin layer is formed so as to overlap the second rim part, leaving out an area from the periphery of the semiconductor substrate to the first rim part of the electrode. |
申请公布号 |
US2004245629(A1) |
申请公布日期 |
2004.12.09 |
申请号 |
US20040802668 |
申请日期 |
2004.03.17 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HANAOKA TERUNAO |
分类号 |
H01L23/29;H01L23/12;H01L23/31;(IPC1-7):H01L27/10 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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