| 摘要 |
<P>PROBLEM TO BE SOLVED: To shorten a distance between a picking position of a chip and a placing position of it for accurately placing the chip on a board, even if wafer diameter is large. <P>SOLUTION: A wafer table 4 is inclined to a supporting face 9 of a substrate table 10, and part of the wafer table 4 is located below the substrate table 10. A pick-and-place system 7 has a shuttle 12 having a swing arm 13 which holds a bonding head 15. The swing arm 13 swingably reciprocates between two fixed swing-positions, and in the first swing position, a longitudinal axis 17 of the swing arm 13 has an angle ψ with a perpendicular to the supporting face 9, and in the second swing position, the longitudinal axis 17 runs orthogonally crossing the supporting face 9. The angle ψ is in a rage of 10° to 50°. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
