| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesiveness of an insulating layer and a conductive layer without roughening the surface of the insulating layer in a method of manufacturing a wiring board having a step for forming a circuit to the insulating layer comprising a resin including a thermosetting polyphenylene ether. SOLUTION: After irradiating a circuit forming surface 21 of the insulating layer 2 comprising the resin including the thermosetting polyphenylene ether with ultraviolet ray, the insulating layer 2 is heated and then the circuit is formed. COPYRIGHT: (C)2005,JPO&NCIPI |
