发明名称 |
METHOD OF FLATTENING SURFACE OF SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE WITH FLATTENED SURFACE, LIQUID CRYSTAL DISPLAY DEVICE, AND ORGANIC ELECTROLUMINESCENT ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate which is provided with a flattened surface and used for a liquid crystal display element and an organic EL element; to provide a flattened substrate used for a semiconductor device; to provide a flattened substrate used for an optical apparatus, such as micro optics or the like; to provide a method of manufacturing the flattened substrate; and to provide a liquid crystal display device, an organic EL element, and a semiconductor device which use the flattened substrate. SOLUTION: A wettability change plane 30 is formed on the surfaces of the recesses 10a of the rugged surface of the substrate through an exposure process, an electric discharge process, and a surface-treating agent. A projection 10b and the recess 10a are made different from each other in wettability. Then, a flattening film 16 is formed only on the recesses 10a taking advantage of a difference in surface wettability so as to flatten the surface of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004349317(A) |
申请公布日期 |
2004.12.09 |
申请号 |
JP20030141912 |
申请日期 |
2003.05.20 |
申请人 |
NEC CORP |
发明人 |
MATSUSHIMA HITOSHI;SUMIYOSHI KEN;TSUBOI SHINZO |
分类号 |
G02F1/1333;B01J35/02;H01L21/027;H01L51/50;H05B33/02;H05B33/14;(IPC1-7):H01L21/027;G02F1/133 |
主分类号 |
G02F1/1333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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