发明名称 METHOD OF FLATTENING SURFACE OF SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE WITH FLATTENED SURFACE, LIQUID CRYSTAL DISPLAY DEVICE, AND ORGANIC ELECTROLUMINESCENT ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a substrate which is provided with a flattened surface and used for a liquid crystal display element and an organic EL element; to provide a flattened substrate used for a semiconductor device; to provide a flattened substrate used for an optical apparatus, such as micro optics or the like; to provide a method of manufacturing the flattened substrate; and to provide a liquid crystal display device, an organic EL element, and a semiconductor device which use the flattened substrate. SOLUTION: A wettability change plane 30 is formed on the surfaces of the recesses 10a of the rugged surface of the substrate through an exposure process, an electric discharge process, and a surface-treating agent. A projection 10b and the recess 10a are made different from each other in wettability. Then, a flattening film 16 is formed only on the recesses 10a taking advantage of a difference in surface wettability so as to flatten the surface of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004349317(A) 申请公布日期 2004.12.09
申请号 JP20030141912 申请日期 2003.05.20
申请人 NEC CORP 发明人 MATSUSHIMA HITOSHI;SUMIYOSHI KEN;TSUBOI SHINZO
分类号 G02F1/1333;B01J35/02;H01L21/027;H01L51/50;H05B33/02;H05B33/14;(IPC1-7):H01L21/027;G02F1/133 主分类号 G02F1/1333
代理机构 代理人
主权项
地址
您可能感兴趣的专利