| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of an imaging device capable of easily mounting the imaging device on a module substrate in a curved state without performing a complicated operation such as vacuum suction. SOLUTION: A sheet-like adhesive material 2 made of epoxy resin is put on a planar member 3 and a planar imaging device 1 is put on the adhesive material 2 further. The imaging device 1 is formed of silicon (Si) whose thermal expansion coefficient is 4 ppm/K. The planar member 3 is made of invar whose thermal expansion coefficient is 2 ppm/K. The temperature of a laminated body composed by piling up the imaging device 1, the adhesive material 2 and the planar member 3 is elevated to 175°C and it is held at the temperature for one hour. Thereafter, the laminated body is returned to a normal temperature. Thus, the imaging device 1 is curved such that a light receiving surface is concave. Thereafter, the planar member 3 is fixed to the module substrate 5. COPYRIGHT: (C)2005,JPO&NCIPI |
