| 摘要 |
A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X-R<1>-Si(OR<2>) nR<3>3-n wherein X is NCS- or SCN-, R<1 >is an alkylene or alkyleneoxyalkylene group, R<2 >and R<3 >are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.
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