发明名称 Rhodium Electroplated structures and methods of making same
摘要 A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.
申请公布号 US2004247920(A1) 申请公布日期 2004.12.09
申请号 US20030456343 申请日期 2003.06.06
申请人 FORMFACTOR, INC. 发明人 ARMSTRONG MICHAEL;HERMAN GAYLE;OMWEG GREG;SHENOY RAVINDRA V.
分类号 C25D3/54;(IPC1-7):H01F3/00;B05B1/00;C09D5/00;C25D3/00 主分类号 C25D3/54
代理机构 代理人
主权项
地址