| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting substrate which needs not keep a component to be resin-sealed away from a component which evades resin-sealing and which can surely seal the component to be resin-sealed with a sufficient amount of resin. SOLUTION: On the component mounting substrate 100, a concave portion 105 is so formed as to separate the component (CSP 102) to be resin-sealed and the component 106 which evades resin-sealing from each other. A surplus liquid resin is caused to flow into the concave portion 105 to prevent the spreading of the liquid resin 104 over the mounting substrate 100. The concave portion 105 is formed in a solder resist 101 formed in the most outer layer of the mounting substrate 100. Instead of forming the concave portion 105, a convex portion 109 may be formed. COPYRIGHT: (C)2005,JPO&NCIPI
|
