| 摘要 |
A package structure includes a substrate, a spacer layer, an integrated circuit, a plurality of wires, and a glue layer. The substrate has an upper surface formed with first connection points, and a lower surface formed with second connection points. The spacer layer is adhered to the upper surface of the substrate by a first adhesive. The integrated circuit has a plurality of bonding pads and is adhered to the spacer layer by a second adhesive. The integrated circuit has an area larger than that of the spacer layer such that a gap is formed between the integrated circuit and the substrate. The wires electrically connect the bonding pads of the integrated circuit to the first connection points of the substrate, respectively. The glue layer is formed on the upper surface of the substrate to encapsulate the integrated circuit and the wires.
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