METHOD AND SYSTEM FOR FILLING VIA HOLE WITH PASTE AND METHOD OF PRODUCING MULTILAYER SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To fill a via hole well with a conductive paste regardless of the aspect ratio of the via hole or the viscosity of the conductive paste, and to perform electrical connection surely and stably.

SOLUTION: The whole of the lower surface of a substrate 1 provided with a through via hole 2 is made to touch the paste liquid surface at the opening 6a of a container 6 containing conductive paste 4 under enclosed state except the opening 6a. Open liquid surface around the substrate 1 at the opening 6a is enclosed with a mask fixing frame 7 and then one side of the substrate 1 and the container 6 is moved to approach the other side or the one side and the other side are moved relatively to approach each other in order to press the conductive paste 4 thus filling the via hole 2 of the substrate 1 with the conductive paste 4.

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