| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a transmissive type optical modulator element in which a through hole is not required to be provided on a Si substrate (opaque substrate) and the miniaturization and the integration are not limited as in a conventional type substrate. SOLUTION: A pixel driving circuit is formed on an SOI substrate composed of an SOI substrate, an insulation layer and a second silicone layer in the first step, and the SOI substrate is removed in a state that the pixel driving circuit side is supported in the second step, further a transparent substrate is joined and an MEM optical modulation part is formed on the pixel driving circuit. COPYRIGHT: (C)2005,JPO&NCIPI
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