发明名称 |
Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
摘要 |
The purpose of the invention is to provide a double-sided adhesive tape which prevents a wafer from damaging even when the wafer has a considerably thin thickness of about 50 mum, which has improved handlability, which is favorably used for processing of an IC chip and which facilitates its peeling, and a method for manufacturing an IC chip using it. A double-sided adhesive tape containing a gas generating agent for generating a gas by stimulation in at least one side thereof.
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申请公布号 |
US2004248382(A1) |
申请公布日期 |
2004.12.09 |
申请号 |
US20040485462 |
申请日期 |
2004.06.23 |
申请人 |
HATAI MUNEHIRO;FUKUOKA MASATERU;HAYASHI SATOSHI;DANJO SHIGERU;OYAMA YASUHIKO;SHIMOMURA KAZUHIRO;HASEGAWA TSUYOSHI |
发明人 |
HATAI MUNEHIRO;FUKUOKA MASATERU;HAYASHI SATOSHI;DANJO SHIGERU;OYAMA YASUHIKO;SHIMOMURA KAZUHIRO;HASEGAWA TSUYOSHI |
分类号 |
C08K5/23;C09J5/08;C09J7/02;C09J11/06;H01L21/301;H01L21/68;H01L21/78;(IPC1-7):H01L21/301 |
主分类号 |
C08K5/23 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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