发明名称 Wired circuit board
摘要 A wired circuit board that can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency even for fine pitch wiring or for high frequency signal. To provide this wired circuit board, a relay flexible wiring circuit board 1 is formed by a first wired circuit board 14 comprising a first metal substrate 16, a first insulating base layer 17, a first conductor layer 18 and a first insulating cover layer 19 which is substantially identical in layer structure with the suspension board with circuit 3 and a second wired circuit board 15 connected with the first wired circuit board 14 for connecting with a control circuit board 4. In this wired circuit board, since the suspension board with circuit 3 and the first wired circuit board 14 are rendered substantially identical in layer structure with each other, both characteristic impedances at these connection points can be matched with each other.
申请公布号 US2004245619(A1) 申请公布日期 2004.12.09
申请号 US20040860493 申请日期 2004.06.04
申请人 TAKEUCHI YOSHIHIKO;OHWAKI YASUHITO;TAKAYOSHI YUICHI 发明人 TAKEUCHI YOSHIHIKO;OHWAKI YASUHITO;TAKAYOSHI YUICHI
分类号 H05K1/03;H01L23/498;H05K1/02;H05K1/05;H05K1/14;H05K3/10;H05K3/18;H05K3/36;(IPC1-7):H01L21/44;H01L23/48 主分类号 H05K1/03
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