| 发明名称 |
Memory module cooling device, especially for PC memory modules, comprises elements for thermally coupling two or more memory modules |
| 摘要 |
<p>Device for cooling memory modules in a computer, especially a PC, comprises elements for thermally coupling two or more individual memory modules, especially DIMM modules. In particular the device comprises a comb-shaped base body (10) that can connected to a fan if necessary.</p> |
| 申请公布号 |
DE10319984(A1) |
申请公布日期 |
2004.12.09 |
| 申请号 |
DE2003119984 |
申请日期 |
2003.05.05 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
STOCKEN, CHRISTIAN;HUBER, THOMAS;SCHROEDER, STEPHAN;PROELL, MANFRED |
| 分类号 |
G06F1/20;H01L23/367;H01L23/433;(IPC1-7):H01L23/34;H01L25/11;H01L23/38;H05K7/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
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