发明名称 WATER-SOLUBLE NEGATIVE PHOTORESIST
摘要 <P>PROBLEM TO BE SOLVED: To provide optimum use of a photoresist coating for packing-and-unpacking processing steps of photoresist exposure. <P>SOLUTION: In use of a photoresist for producing closely spaced contact holes, the surface of a first photoresist layer is exposed through a first mask including first and second patterns of contact holes; in accordance with the first and second patterns of contact holes, openings are formed in the first photoresist layer; a second negative photoresist layer is deposited on the surface of the first photoresist layer; and in accordance with the second pattern of contact holes, openings are formed in the second photoresist layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004348141(A) 申请公布日期 2004.12.09
申请号 JP20040153316 申请日期 2004.05.24
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO;CLARIANT INTERNATL LTD 发明人 HO BANG-CHEIN;CHEN JIAN-HONG;TAKANO YOSUKE;LU PING-HUNG
分类号 G03F7/004;G03F1/00;G03F7/00;G03F7/038;G03F7/095;G03F7/20;G03F7/40;H01L21/027 主分类号 G03F7/004
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